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  1 pnz323b (pn323b) pin photodiode for optical control systems pin photodiodes electro-optical characteristics (ta = 25?c) parameter symbol conditions min typ max unit dark current i d v r = 10v 5 50 na photo current i l v r = 10v, l = 1000 lx *1 31 a sensitivity to infrared emitters s ir *2 v r = 5v, h = 0.1mw/cm 2 3.2 4 a peak sensitivity wavelength p v r = 10v 970 nm response time t r , t f *3 v r = 10v, r l = 1k ? 50 ns response time t r , t f *3 v r = 10v, r l = 100k ? 5 s capacitance between pins c t v r = 0v, f = 1mhz 70 pf acceptance half angle measured from the optical axis to the half power point 70 deg. *1 measurements were made using a tungsten lamp (color temperature t = 2856k) as a light source. *2 light source : = 940 nm *3 switching time measurement circuit 50 ?  p = 800nm t d : delay time t r : rise time (time required for the collector photo current to increase from 10% to 90% of its final value) t f : fall time (time required for the collector photo current to decrease from 90% to 10% of its initial value) sig.in      "$0+?@ 33#
?33#
= 1=  (   ' ;( ; ( @$;)) +! $3 .+9 0.2 not soldered 1.5 max. 0.5 1.0 (2) 7.5 0.2 5.5 0.2 6.0 0.2 31.25 1.0 1.5 0.2 22.25 1.0 (1.5) 0.5 1.32 2.54 12 3.8 0.2 (2.3) 0.6 0.1 2- 0.6 0.1 absolute maximum ratings (ta = 25?c) parameter symbol ratings unit reverse voltage (dc) v r 30 v power dissipation p d 100 mw operating ambient temperature t opr C30 to +85 ?c storage temperature t stg C 40 to +100 ?c features fast response which is well suited to high speed modulated light detection : t r , t f = 50 ns (typ.) high sensitivity, high reliability peak sensitivity wavelength matched with infrared light emitting diodes : p = 970 nm (typ.) wide detection area, wide acceptance half angle : = 70 deg. (typ.) adoption of visible light cutoff resin note) the part number in the parenthesis shows conventional part number.
2 pin photodiodes pnz323b v r = 10v i d ta ambient temperature ta (?c ) dark current i d (na) C 40 20 60 100 C 20 04080 10 1 10 C1 10 2 10 3 i l ta 160 140 120 100 80 60 40 20 ambient temperature ta (?c ) relative photo current i l (%) C 20 0 20 60 80 40 100 0 C 40 v r = 10v l = 1000 lx t = 2856k c t v r reverse voltage v r (v) capacitance between pins c t (pf) 100 80 60 40 11010 2 0 20 10 C2 10 C1 spectral sensitivity characteristics 100 80 60 40 20 wavelength (nm) relative sensitivity s (%) 700 800 900 1000 1100 1200 0 600 v r = 10v ta = 25?c ta = 25?c p d ta power dissipation p d (mw) 120 100 80 60 40 20 ambient temperature ta (?c ) 0 20406080100 0 C 30 i l l 10 3 10 2 10 1 illuminance l (lx) photo current i l ( a) 10 2 10 3 10 4 10 C1 10 v r = 10v ta = 25?c t = 2856k 1 10 C1 0 163248 82440 i d v r reverse voltage v r (v) dark current i d (na) 10 10 2 directional characteristics 100 80 60 40 20 0 80 40 0 40 80 angle (deg.) relative sensitivity s (%) t r , t f r l 10 2 10 1 10 C1 external load resistance r l (k ? ) rise time, fall time t r , t f ( s) 11010 2 10 C2 10 C1 10% 90% t d t r t f r l v r = 10v sig. out 50 ? sig.in
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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